Fully automatic and highly efficient dicing
Highly efficient wafer dicing, excellent hardware quality and continuously upgraded software system, enabling customer to dice wafers efficiently.
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Highly efficient
Twin spindles work together to dice 12"" wafers automatically and efficiently, leading to shorter cycle times.
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Fully automatic
Automatic wafer loading and unloading, automatic wafer cleaning, less workers required.
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Highly adaptable
NCS (Non-contact Setup) and BBD (Blade Breakage Detection) are standard features.
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Easy to use
User-friendly operation interface, upgrade of software as requested by customer, easy for customer to import.
+86-0510-81816658
sales@wxautowell.com
No.3 Xinhua Road,
